 (1001 KB) |
Transient Performance of Common Modeling Assumptions Used in Detailed Thermal Package Models John Parry, Flomerics Ltd. |
|
(404 KB) |
Component and Board-Level Thermal Modeling Techniques for XFP Optical Transceivers Ted Lee, Flomerics Inc. |
|
(230 KB) |
Heat Sink Optimization for Optical Transponders Z. F. Shi, Albert C.W. LU, Y.M. Tan, K.H.Ang, Singapore Institute of Manufacturing Technology |
|
(2760 KB) |
Thermal Modeling and Measurement of Large High Power Silicon Devices With Asymmetric Power Distribution Jefferey Deeney, Hewlett-Packard Company |
|
(366 KB) |
The Extraction of a Two-Resistor/Two-Capacitor Model for Common IC Packages and their Implementation in CFD David W. Stiver, Sarang Shidore Flomerics Inc. |
|
(400 KB) |
Linearized Superposition using CFD for Thermal and Power Characterization of Electronic Equipment with Significant Thermal Radiation and Natural Convection Paul Gauché, Flomerics Inc |
|
(1350 KB) |
FLO/STRESS: An Integrated Software Module to Predict Stress in Electronic Products M. Warner, J. Parry, C. Marooney, H. Reeves, A. Agha and I. Clark, Flomerics Inc. |
|
(1830 KB) |
Thermal Simulation of Telecom Racks Wim Nelemans, Alcatel |
|
(2630 KB) |
Thermal analysis of an UHP high current driver Arjan Kole, Thermal & Mechanical Analysis, Philips Centre for Industrial Technology |
|
(542 KB) |
Numerical Analysis of Thermoelectric Coolers (TEC) Using FLOTHERM States Chiwanga, Solectron Technical Centre |
|
(663 KB) |
Indoor Base Station Space Model Vs Flotherm Lucias Akalanne, Lucent Technologies |
|
(538 KB) |
Integration of Flotherm Within HS Marston Aerospace Ltd Adrian Green, HS Marston Aerospace Ltd |
|
(423 KB) |
Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures of Chilled Air Exiting both the Hot and Cold Aisles Roger Schmidt, Ethan Cruz, IBM Corporation |
|
(255 KB) |
Prediction of Thermal Performance of Flip Chip - Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Substrate Physical Design K.Ramakrishna, T-Y. Tom Lee, Advanced Process Development and External Research, Digital DNA Laboratories, Semiconductor Products Sector, Motorola, Inc. |
|
(737 KB) |
Thermal Assessment of RF Integrated LTCC Front End Module (FEM) Victor Adrian Chiriac and Tien-Yu Tom Lee, Final Manufacturing Technology Center, Motorola, Inc. |
|
(255 KB) |
A Numerical Study of the Thermal Performance of an Impingement Heat Sink - Fin Shape Optimization: Amit Shah, Bahgat Sammakia and Hari Srihari, The State University of New York at Binghamton |
|
(1024 KB) |
Using Cap-Integral Standoffs to Reduce Chip Hot-Spot Temperatures in Electronic Packages Michael S. June, Kamal K. Sikka, IBM Microelectronics |
|
(2600 KB) |
Numerical Analysis of an Array of Ball Grid Components Reena Cole and Mark Davies, Stokes Research Institute,
Mechanical and Aeronautical Engineering Dept |
|
(304 KB) |
Thermal Considerations in Cooling Large Scale High Compute Density Data Centers
Chandrakant D. Patel, Ratnesh Sharma, Cullen E. Bash and Abdlmonem Beitelmal, Hewlett-Packard Laboratories |
|
(1095 KB) |
Thermal Design Methodology for Electronic Systems Angie Minichiello, P.E., Space Dynamics Laboratory / Utah Sate University |
|
(698 KB) |
Comparison of Numerical Predictions and Experimental Measurements for the Transient Thermal Behavior of a Board-Mounted Electronic Component Valérie Eveloy and Peter Rodgers, Electronics Thermal Management Ltd |
|
(336 KB) |
Getting the Most Out of Your CFD Program
Robert J. Moffat, Department of Mechanical Engineering Stanford University (Emeritus) |
|
(531 KB) |
A Design Approach to Thermal Characterization of Forced Convection
Systems using Superposition in CFD
Paul Gauché, Flomerics Inc |
|
(418 KB) |
Thermal Performance Comparison of a Microprocessor using Phase Change Materials in Various Configurations
Paul Gauché and Sarang Shidore, Flomerics Inc |
|
(698 KB) |
Investigating Limits in Naturally Cooled Systems Using FLOTHERM Paul Gauché and Melanie Heck, Flomerics Inc |
|
(230 KB) |
An Integrated Approach to Flow, Thermal and Mechanical Modeling of Electronics Devices
John Parry, Chris Marooney, Flomerics Limited |
|
(171 KB) |
Modeling Large-Scale Electronic Systems Using Computational Fluid Dynamics Through a¡°Zoom-in¡± Approach
Anurag Gupta, Flomerics Inc |
|
(215 KB) |
Enhanced Electronic System Reliability - Challenges for Temperature Prediction
John Parry, Flomerics Limited |
|
(238 KB) |
FLO/STRESS: An Integrated Stress Solver For The CFD Tool FLOTHERM M. Warner, C. Bailey and K. Pericleous, School of Computing and Mathematical Sciences, The University of Greenwich |
|
(83 KB) |
Thermal design of an Optical Network Unit (ONU) to be implemented into an outdoor enclosure Hans Berger, Marconi Telecommunications, Backnang, Germany. |
|
(120 KB) |
DELPHI Compact Models Revolutionize Thermal Design Sarang Shidore and Dr. Akbar Sahrapour, Flomerics Inc. |
|
(307 KB) |
Power
stagethermal design for DDX Amplifiers
Ken Korzeniowski, Sr. Design Engineer, Apogee Technology Inc. |
|
(1,214KB) |
Characterisation
of boundary conditions for an aircraft engine electronic control unit
Nathalie
Kopp, Jean-Yves Soulier, Snecma Control Systems, France |
 ppt part 1 (1,507 KB) ppt part 2 (2,409KB) |
Excellence in Automation and Drives Dieter
Muench, Siemens, Germany |
|
(99KB) |
Cooling Analysis for Plasma Display Panel Enclosure Insoo
Cho, Wooyung Soh, Wooman Jeong, and Kwngbok Shin - Engineering Analysis
& Design Team PDP Business Division, Samsung SDI Corp., Korea |
|
(148KB) |
Thermal
analysis of an UHP high current driver
Arjan
Kole, Philips Centre for Industrial Technology, The Netherlands |
|
(556KB) |
Heat
Spreading and Conduction in Compressed Heatsinks
|
|
(1,263KB) |
Design
Characteristics of High Performance and Reduced Cost Chip Scale Package
- µBGA
James
C.C. Lee, Kei G.D. Luo, Meicer Semiconductor INC., Taiwan |
|
(387KB) |
Thermal analysis of a Telecommunications Multi-Service Access Functional Processor Module using CFD States
G. Chiwanga, C-MAC Engineering Limited, UK |
|
(671KB) |
Thermal Simulations Applied to Embedded Cryptographic Coprocessor Devices Gabriele
Campi, Development Engineer, Packaging & Technology Development
Department, Celestica Italia s.r.l. |
|
(306KB) |
Modeling
in Flotherm the effects of airflow impedance produced by several blowers
working together on the same plane
Katya
Puzyrko, Research Analyst, Caspian Networks, USA |
|
(11KB) |
Simulation
of High Efficiency Heatsinks for rectifiers in the Telecommunication
Industry- Why a heat sink manufacturer decided to choose Flotherm
Jörg
Peters, Managing Director Alutronic Kühlkörper, Germany |
|
(209KB) |
High performance/volume ratio CPU Cooler Design with FLOTHERM simulation Chen, Honglong, R&D manager, Kwo-Ger Metal Technology Co. |
|
(834KB) |
Thermal Management of Palmtop Projector products Optoma 2nd FLOTHERM Taiwan Users Conference, Taipei, Taiwan - 7th December 2000 |
|
(141KB) |
Parametric Study of Thermal Characteristics of Plastic Ball Grid Array by Computational Fluid Dynamics Terry Ku, Manufacturing and Product Engineering Department, VIA Technologies, Inc. 2nd FLOTHERM Taiwan Users Conference, Taipei, Taiwan - 7th December 2000 |
|
(299KB) |
Application of CFD Technique in Thermal Design of a Telecommunication Base Station Dan Nguyen, Ph.D. Senior Mechanical Engineer, Nokia Networks, Matti Kokko, M. Sc. Senior Design Engineer, Nokia Networks 9th International Flotherm User Conference, Orlando, USA |
|
(550KB) |
Thermal Design Process At Teradyne's Industrial Consumer Division Mike Damiano Platform Engineering Group, Teradyne Industrial Consumer Division 9th International Flotherm User Conference, Orlando, USA |
|
(121KB) |
Case Study of Thermal Management for Mobile Multi-Media (MMM) Applications Arvind Krishna, Delphi Delco Electronics Systems 9th International Flotherm User Conference, Orlando, USA |
|
(416KB) |
Fan Swirl and Planar Resistances Don't Mix Tony Kordyban, Tellabs, Bolingbrook IL 9th International Flotherm User Conference, Orlando, USA |
|
(207KB) |
Numerical and physical simulation hand in hand to determine the thermal conductivity of a PCB. R.A.M.L. van Galen Philips Centre for Industrial Technology 9th International Flotherm User Conference, Orlando, USA |
|
(276KB) |
Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process Victor Adrian Chiriac and Tien-Yu Tom Lee Interconnect Systems Laboratory, Semiconductor Products Sector, Motorola, Inc 9th International Flotherm User Conference, Orlando, USA |
|
(212KB) |
Automated Electronic Module Thermal Design Using Flotherm V.2 and AutoTherm Marcelle Ibrahim,Raytheon Electronic Systems Tewksbury MA, Steve Addison Flomerics Incorporated Marlboro MA, Leo Paradis Raytheon Electronic Systems Tewksbury, MA. 9th International Flotherm User Conference, Orlando, USA |
|
(47KB) |
Modeling, Validation and Thermal Solution Design for a Flip-Chip Plastic Ball Grid Array Package Edward Iwamiya, Cisco Systems 9th International Flotherm User Conference, Orlando, USA |
|
(194KB) |
Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications V H. Adams, DigitalDNA Laboratories Austin, TX, V A. Chirac & T-Y. Tom Lee, DigitalDNA Laboratories, Tempe, Arizona. 9th International Flotherm User Conference, Orlando, USA |
|
(301KB) |
Analysis of a Heat Pipe Assisted Heat Sink |
|
(196KB) |
Celestica Gabriele Campi, Packaging & Technology Development Department, Celestica 9th International Flotherm User Conference, Orlando, USA |
|
(616KB) |
Using FLOTHERM and the Command Center to Exploit the Principle of Superposition Paul Gauch? Flomerics Inc. 9th International Flotherm User Conference, Orlando, USA |
|
(1,750KB) |
Thermal Design for Notebook PC by using Thermal Analysis Man-In Baek, LG Electronics, Jung-Mi Lee, LG Electronics 9th International Flotherm User Conference, Orlando, USA |
|
(1,011KB) |
CFD System Level Modeling of a Large Telecommunications Enclosure Todd A. Newhouse, Advanced Fibre Communications 9th International Flotherm User Conference, Orlando, USA |
| Simulation of Steady State and Transient Solar Loading of Outdoor Fiber Optic Enclosure Bisher J. Rayyahin, Marconi Communications, Bryan D. Simmons, Marconi Access Systems 9th International Flotherm User Conference, Orlando, USA |
|
| Modelling Of A Phase Change Material Thermal Battery Ericsson |
|
| Multiphysics Modeling For Electronics Design John Parry, Chris Aldham, Flomerics Ltd Chris Bailey, Centre for Numerical Modelling and Process Analysis University of Greenwich |
|
|
A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package Sanjeev B. Sathe, Microelectronics Division, IBM Corporation |
|
|
A Study of Compact Thermal Model Topologies in CFD for a Flip Chip Plastic Ball Grid Array Package |
| Thermal Modeling of Chip Scale Packages for Power Applications in Telecommunication Equipment Pavel Valenta, Alcatel SEL ESCHETA(*) Review Meeting Berlin, March 16, 2000 (*) European Sources of Chip Scale Packages for Harsch Environment, Telecom & Automotive |
|
| Numerical And Experimental Investigation Of A Tape Ball Grid Array Package
Jay Ewanich, Toshiba America, Sarang Shidore, Sepideh Pashaei-Rad, Flomerics Inc. |
|
| An Airspeed Measurement Technique for Accurate Correlation to CFD Simulation Results Joseph W. Plunkett, Hybricon Corporation HD-International 2000 Conference Denver, CO, USA |
|
|
T250
837KB) |
Design and Thermal Analysis of the SunRay1 Network Terminal Jay Osborn, Sun Microsystems Inc.Karl Jacobson, Flomerics Inc. HD-International 2000 Conference Denver, CO, USA |
|
T249
646KB) |
Modeling Phase Change Material in Electronics using CFD ?A Case Study Paul Gauché, Weiran Xu, Flomerics Inc. HD-International 2000 Conference Denver, CO, USA |
|
T248
(653KB) |
Creation and Validation of a Two-Resistor Compact Model of a Plastic Quad Flat Pack (PQFP) Using CFD Weiran Xu, Sarang Shidore, Paul Gauché, Flomerics Inc. HD-International 2000 Conference Denver, CO, USA |
| Thermal characteristics of complex systems M. Di Ianni, C. Porrati, Bull HN Information Systems Italia, L. Codecasa, Politecnico di Milano IMAPS 99 Conference |
|
|
Competitive Analysis: 9 Slot CompactPCI?Development Chassis Joseph Plunkett, Hybricon CorporationPerformance Data |
|
| An Optical And Numerical Investigation Of The Thermal Interaction Between An Isothermal Cylinder And Its Isothermal Enclosure D.T Newport*, T.M.Dalton*, M.R.D.Davies*, M.Whelan+, C Forno+ (*PEI Technologies, University Of Limerick, Ireland)(+ Institute For Systems, Informatics & Safety, European Commission, Italy) Proceedings of 33rd ASME National Heat Transfer Conference, Albuquerque, New Mexico, 15-17 August 1999 |
|
| A Thermal Design Methodology For Electronic Systems - Part II: System Level Ronan Grimes, Mark R. Davies, Jeff Punch, Tara Dalton, Reena Cole (PEI Technologies, University Of Limerick, Ireland) Proceedings of 33rd ASME National Heat Transfer Conference, Albuquerque, New Mexico, 15-17 August 1999 |
| A Thermal Design Methodology For Electronic Systems - Part I: Board And Component Level Reena Cole, Tara Dalton, Jeff Punch, Mark R. Davies, Ronan Grimes (PEI Technologies, University Of Limerick, Ireland) Proceedings of 33rd ASME National Heat Transfer Conference, Albuquerque, New Mexico, 15-17 August 1999 |
|
| Simplified Analytical Models for Forced Convection Heat Transfer from Cuboids of Arbitrary Shape J R Culham, M M Yovanovich, P Teertstra & C-S Wang (Univ Waterloo, Ontario, Canada), G Refai Ahmed (Astec APS), Ra-Min Tain (Nortel) Proceedings of ASME InterPACK '99 Maui, Hawaii - June 1999 |
|
| Validating Numerical Predictions of Component Thermal Interaction on Electronic Pronted Circuit Boards In Forced Convection Airflows By Experimental Analysis P Rogers, J Lohan, V Eveloy, C-M Fager & J Rantala (Nokia) Proceedings of ASME InterPACK '99 Maui, Hawaii - June 1999 |
|
| Thermal Strategy for Modeling The Wirebonded PBGA Packages Victor Chiriac (Univ Arizona) & T-Y Tom Lee (Motorola) Proceedings of ASME InterPACK '99 Maui, Hawaii - June 1999 |
|
| Integrated Thermal Analysis of an Automotive Electronic System S S Murthy & Y K Joshi (CALCE, Univ Maryland), V H Adams & K Ramakrishna (Motorola) Proceedings of ASME InterPACK '99 Maui, Hawaii - June 1999 |
|
| Design-Based Thermal Performance Evaluation of a GaAs MMIC Device in a Plastic Ball Grid Array Package V H Adams, K Ramakrishna, T-Y Tom Lee, J V Hause & M Mahalingham (Motorola) Proceedings of ASME InterPACK '99 Maui, Hawaii - June 1999 |
|
| Thermal Model of Buried Resistors and Design Gidelines for Buried Components S Sathe (IBM) and B Sammakia (State Univ of New York, Binghampton) Proceedings of ASME InterPACK '99 Maui, Hawaii - June 1999 |
|
|
T236 |
A Comparative Study of the Performance of Compact Model Topologies and their Implementation in CFD for a Plastic Ball Grid Array S Shidore (Flomerics) and T-Y Tom Lee (Motorola) Proceedings of ASME InterPACK '99 Maui, Hawaii - June 1999 |
|
T235
(447KB) |
CFD Modeling of a Therma-Base(TM) Heat Sink Kevin Grubb, Thermacore Inc, PA, USA 8th International FLOTHERM User Conference, Las Vegas, USA, 13-14 May 1999 |
|
T234
(573 KB) |
Thermal Analysis of MAXITE Micro Base Station Peter Melin PhD, Ericsson Microwave Systems AB, Sweden 8th International FLOTHERM User Conference, Las Vegas, USA, 13-14 May 1999 |
|
T233
(62 KB) |
The Significance of Radiation in a Central Office Chassis: A Case Study Jim Van Gilder & Akbar Sahrapour, Flomerics Inc 8th International FLOTHERM User Conference, Las Vegas, USA, 13-14 May 1999 |
|
T232
(331 KB) |
Software Simulation of a Double-Sided PCB Edward Iwamiya, Cerent Corp, CA, USA 8th International FLOTHERM User Conference, Las Vegas, USA, 13-14 May 1999 |
|
T231 |
The Customizing of FLOTHERM Modeling Wen Zhi Min & Choo Kok Fah, DSO National LAboratories, Singapore 8th International FLOTHERM User Conference, Las Vegas, USA, 13-14 May 1999 |
|
T230
(289KB) |
3D Model to Analyse the Thermal Behaviour of a Digital Rectifier Silvio L.M.Junquiera, Christian Naaktgeboren, Federal Center for Education in Technology, Curitiba-PR, Brazil 8th International FLOTHERM User Conference, Las Vegas, USA, 13-14 May 1999 |
|
T229
(345KB) |
Thermal Analysis of an Electronic Enclosure in a Harsh Working Environment V. Chinniah, Advanced Industrial Design Group, Singapore Technologies Electronics, Singapore 8th International FLOTHERM User Conference, Las Vegas, USA, 13-14 May 1999 |
|
T228
(1MB) |
Thermal Characterization of Cavity-Down TBGA (Tape Ball Grid Arrays) Package with FLOTHERM simulation Eric Tan, Taiwan Semiconductor Technology Co., HsinChu Science-Based Industrial Park, Taiwan 8th International FLOTHERM User Conference, Las Vegas, USA, 13-14 May 1999 |
| FLOTHERM in the Thermal Design in Philips Consumer Electronics P.B.J.Schaareman, Philips Consumer Electronics, The Netherlands 7th International FLOTHERM User Conference, Verona, Italy, 3-4 September 1998 |
|
| Thermal Design and Evaluation Methods for Heat Sinks Donglyoul Shin, E-CIM Team, Samsung Electronics Company, South Korea 7th International FLOTHERM User Conference, Verona, Italy, 3-4 September 1998 |
|
| Thermal Experiment and Analysis of Small Desktop Enclosure Kazayuki Akashi, NEC Engineering Ltd, Japan 7th International FLOTHERM User Conference, Verona, Italy, 3-4 September 1998 |
|
| The use of FLOTHERM at Ericsson Radio Systems - Past and Future Jonas Bogren, Ericsson Radio Systems, Stockholm, Sweden 7th International FLOTHERM User Conference, Verona, Italy, 3-4 September 1998 |
| Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling Bennet Joiner, Vance Adams, Motorola Semiconductor Product Sector 15th IEEE Semi-Therm Symposium, San Diego, CA, 9-11 March 1999 |
|
| Thermal Design for Flip-Chip on Board in Natural Convection Ching-Bai Hwang, Industrial Technology Research Institute, Taiwan 15th IEEE Semi-Therm Symposium, San Diego, CA, 9-11 March 1999 |
|
| Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments Peter Rodgers, Valerie Eveloy, John Lohan, Carl-Magnus Fager, Pekka Tiilikka, Jukka Rantala, Nokia Research Centre, Finland 15th IEEE Semi-Therm Symposium, San Diego, CA, 9-11 March 1999 |
|
| Thermal-Electrical Modeling of Electrical Subsystems Brendan H. Doerstling, Delphi Packard Electric Systems Society of Automotive Engineers International Congress and Exposition, Detroit, Michigan, USA, 23-26 February 1998. |
|
| A Comparison of CFD Analysis and Experiments: The Case for Heat Pipe in RF Power Amplifier Applications Michael C. Yang, Motorola (PSG), Fort Worth, TX. International Systems Packaging Symposium (ISPS), January 1999, San Diego, CA. |
|
|
T216
(1.2MB) |
Significance of Radiation in Telecommunications Racks Jim VanGilder, Flomerics Inc, Marlborough, MA. International Systems Packaging Symposium (ISPS), January 1999, San Diego, CA. |
| Optimizing the Integration of a Electronics System into an Existing Enclosure Using CFD Modeling Techniques David Lober, Motorola Computer Group, Tempe, AZ. International Systems Packaging Symposium (ISPS), January 1999, San Diego, CA. |
|
|
T214
(1.8MB) |
Vent Design Optimization to Meet Cooling and EMI Requirements David G. Wang, J. Ted DiBene, Keith Muller, and Jim Knighten, NCR Corp., San Diego, CA. International Systems Packaging Symposium (ISPS), January 1999, San Diego, CA. |
|
T212
(1.4MB) |
System-Level Thermal Modeling of a Compact, High-Efficiency Cooling Device for the PA8000 Processor Guy R. Wagner, Hewlett-Packard Company, Fort Collins, CO. International Systems Packaging Symposium (ISPS), January 1999, San Diego, CA |
|
T210 |
Computational and Experimental Studies for Radio Thermal Management Arvind Krishna, Delco Electronics Corporation, Kokomo, IN, USA Society of Automotive Engineers Conference, Vehicle Thermal Management Systems III, May 1997, Indianapolis, USA |
| Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications K. Ramakrishna, System Interconnect Technologies, Motorola Inc., USA, J. R. Trent, Powertrain Systems Division, Motorola Inc., USA CAD/CAE and Thermal Management Issues in Electronic Systems, D. Agonafer et al. (editor), ASME Electrical and Electronic Packaging Division, pp 13-21, EEP-Vol 23 and HTD-Vol 356. |
|
| Thermal Characterisation of SSOP Packages Orla Slattery, John Barrett, Martin O'Flaherty, Kenneth Rodgers NMRC, Ireland, Willem Temmerman, Wim Nelemans Alcatel Bell, Central Research Division, Belgium Eurotherm 58 Conference, Nantes, France, September 1997 |
|
| Thermal Characterization and Modelling of EFD Transformers, Applying DELPHI Methodology Y. Assouad, F. Gatfosse, T. Gautier, Thomson-CSF Radars and Contre Mesures, France Eurotherm 58 Conference, Nantes, France, September 1997 |
|
| Compact Transient Thermal Models for the Polymer Stud Grid Array (PSGATM) Package F. Christiaens, E. Beyne, B. Vandevelde, J. Roggen, R. Mertens, J. Van Puymbroeck, M. Heerman, J. Berghmans Eurotherm 58 Conference, Nantes, France, September 1997 |
|
| Development and Application of Compact Models of Packages Based on DELPHI Methodology Harvey Rosten, J. D. Parry, Flomerics Limited, UK Eurotherm 58 Conference, Nantes, France, September 1997 |
|
| Package Geometry Considerations in Thermal Compact Modeling Strategies V. H. Adams, Y. Joshi, University of Maryland, USA, D. L. Blackburn, D. W. Berning, Semiconductor Electronics Division, Eurotherm 58 Conference, Nantes, France, September 1997 |
|
| Thermal Management in Industrial Product Development H. J. Eggink, Central Development Lighting, Philips Lighting B. V., Eindhoven, The Netherlands Eurotherm 58 Conference, Nantes, France, September 1997 |
|
| Thermal-Fluid Simulation of Computer System Cooling and Verification of Simulation Accuracy Nobuyoski Yamaoka, Fujitsu Limited, Japan 6th International FLOTHERM User Conference, Cambridge, Massachusetts, USA, October 1997 |
|
| Thermal Analysis of Desktop Codec Kazuyuki Akashi, NEC Engineering, Japan 6th International FLOTHERM User Conference, Cambridge, Massachusetts, USA, October 1997 |
|
| A Proposed Technique for the Modeling of Radial Blowers in Flotherm Sarang Shidore, Joseph Dorsey, Flomerics Inc., Santa Clara, CA, USA 6th International FLOTHERM User Conference, Cambridge, Massachusetts, USA, October 1997 |
| Thermal Modeling and Simulation of Transmission Equipment Hitoya Nakamura, NEC Corporation, Japan 6th International FLOTHERM User Conference, Cambridge, Massachusetts, USA, October 1997 |
|
|
T198 |
System Level Thermal Analysis of a Telecommunication High Density Echo Canceller Cabinet Ying Zhang, Lucent Technologies, Holmdel, NJ, USA 6th International FLOTHERM User Conference, Cambridge, Massachusetts, USA, October 1997 |
| Flotherm Thermal Analysis of Heat Sink Design for Pentium Processor in Tape Carrier Packages Sharon Adam, FORE Systems, Warrendale, PA, USA 6th International FLOTHERM User Conference, Cambridge, Massachusetts, USA, October 1997 |
|
| Display Panel Thermal Design and Analysis Catherine R. Biber Ph.D., Wakefiled Engineering, Wakefield, MA, USA, Vinod Sigh, GE Transportation Systems, Erie, PA, USA 6th International FLOTHERM User Conference, Cambridge, Massachusetts, USA, October 1997 |
|
| Applications of Electronics Compact Models to the Prediction of Transient Heat Transfer in Tactical Missiles Marcelle S. Ibrahim, Raytheon Electronic System Laboratories, Tewksbury, MA, USA 6th International FLOTHERM User Conference, Cambridge, Massachusetts, USA, October 1997 |
|
| Concurrent Design of a PowerPCtm Microcomputer: EDA and CFD Tool Interoperability Gary Kroman, Motorola, Austin, TX, USA 6th International FLOTHERM User Conference, Cambridge, Massachusetts, USA, October 1997 |
|
| Cooling analysis of Digital's ATMswitch 900 John Thayer, Digital Equipment, Corporation, Littleton, MA, USA 6th International FLOTHERM User Conference, Cambridge, Massachusetts, USA, October 1997 |
|
| Some Tricks of the Trade of a FLOTHERM User Tony Kordyban, Tellabs, Lisle, IL, USA 6th International FLOTHERM User Conference, Cambridge, Massachusetts, USA, October 1997 |
|
| Development of Optimized Component-Level Thermal Behavioural Models of a Plastic-Ball-Grid Array Interconnect Technology For Air Cooled Applications Sarang Shidore, Steve Addison, Flomerics Inc., USA, Gary Kromann, Motorola, USA InterPACK 97, Hawaii, USA |
|
| Thermal Analysis of a Chip on Board (COB) J. De Moerloose and W. Temmerman , Alcatel Telecom, Belgium 13th IEEE Semi-Therm Symposium, January 1997 |
| Issues in Validating Package Compact Thermal Models for Natural Convection Cooled Electronic Systems V. H. Adams, Y. Joshi, University of Maryland, USA, D. L. Blackburn, D. W. Berning, Seminconductor Electronics Division, National Institute of Standards and Technology, USA 13th IEEE Semi-Therm Symposium, January 1997 |
|
| Thermal Sub-Modeling of the Wirebonded Plastic Ball Grid Array Package Zane Johnson, K. Ramakrishna, Bennet Joiner, Mike Eyman, Semiconductor Product Sector, Motorola Inc, Austin, Texas, USA 13th IEEE Semi-Therm Symposium, January 1997 |
|
| Pressure Drop and Heat Transfer in an Isothermal Channel with Impinging Flow Catharina R. Biber, Ph.D., Wakefield Engineering Inc, MA, USA. SEMITHERM 97, Austin, Texas, USA. |
|
| Delphi project. A status report on the EC-funded project to develop libraries of thermal models and define new standards for thermal characterisation of electronic parts Harvey Rosten, Technical Director, Flomerics Limited, UK 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| The Performance of Displacement-Cooling Systems in Telecom Applications Ari Kemppainen, Ericsson R&D, Sweden 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| Thermal Analysis and reliability prediction for airborne digital audio system Vladimir Shvarts, ALD, Israel 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
|
T182
(1,098KB) |
Thermal Analysis of an integrated motor and finned housing Dr D A Staton, Control Techniques, UK 5th International FLOTHERM User Conference, Paris, France, September 96 |
| Thermal and airflow analysis of Sequent's New Generation Enterprise Server based on the Intel Pentium/Pro microprocessor Hank Bosak, Sequent Computer, USA 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| Linking CFD and EDA tools: The interoperability of Flotherm and BoardStation/Autotherm during concurrent design of a Motorola PowerPC-based microcomputer Vincent Pimont, Mentor Graphics, USA, Gary Kromann, Motorola, USA 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| Design and testing of a forced-convection loop to ensure rapid heating of an oil tank Thierry Gautier, Thomson CSF, France 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| Thermal characterisation of a power module Areski Belache, Thomson-CSF, France 5th International FLOTHERM User Conference, Paris, France, September 96 |
| Thermal Modelling of sealed equipment enclosures in outdoor enclosures Sadaaki Matsumoto, NEC Engineering, Japan 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| Using CFD to predict the flow behaviour of the UHP lamp during the development of a new LCD projector Wim Evers, Philips, Holland 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| Cooling design of a sealed Optical Network Unit (ONU) enclosure Mark Hendrix, Fujitsu Communications, USA 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| System-level thermal model of an audio set Pierre Kil, Philips CFT, Holland 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| Thermal Model of a Bench-Top Microprocessor-Based Unit N Parameswaran, SAMEER, India 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| Use of FLOTHERM to predict temperature inside sealed aluminium enclosures housing telephony and video equipment Katya Puzyrko, Ericsson Raynet, USA 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| Surface-Mount Heat Sink Thermal Analysis Dr Catharina Biber, Wakefield Engineering, USA 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| Thermal Modelling of Ball-Grid-Array Dr Pavel Valenta, Alcatel SEL AG, Germany 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| Thermal Analysis of a PC chassis Rolf Konstad, Intel, USA 5th International FLOTHERM User Conference, Paris, France, September 96 |
|
| Final report to SEMITHERM XIII on the European-Funded Project DELPHI - the Development of Libraries and Physical Models for an Intergrated Design Environment Harvey Rosten, J D Parry, Flomerics Limited, UK; C J M Lasance, H Vinke, Philips Research and Philips CFT, Netherlands; W Temmerman and W Nelemans, Alcatel Bell, Belgium, Y Asoud and T Gautier, Thomson CSF, France O Slattery, C Cahill and M O'Flattery, NMRC, Ireland, C Lacaze and P Zemlianoy, Alcatel Espace, France. . SEMITHERM XIII January 1997, Austin,Texas, USA |
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T166 |
DELPHI, A status report on the European-funded project for the development of libraries and physical models for an Integrated Design Environment Harvey Rosten, Technical Director, Flomerics Limited. . 46th ECTC, Orlando, Florida, May 28-31, 1996 |
| The Development of Component-Level Thermal Compact Models of a C4/CBGA Interconnect Technology: The Motorola Power PC 603TM and Power PC 604TM RISC Microprocessors John Parry, Harvey Rosten, Flomerics Limited, Hampton Court, Gary B Kromann, Motorola, Austin, Texas. . 46th ECTC, Orlando, Florida, May 28-31, 1996 |
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| Thermal Characterization of a 3-Dimensional Memory Module Tae-Hyun, Joonghyun Baek, S H Seol, J J Kim, Y B Sun, S Y Oh, Package Development, Samsung Electronics Co. Ltd, Korea. 12th IEEE Semi-Therm Symposium, March 1996 |
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| Thermal Evaluation of Standard and Power TQFP T Zhou, M Hundt SGS Thomson Microelectronics, Inc, USA, Valter Motta, SGS Thomson Microelectronics Inc, Italy. 12th IEEE Semi-Therm Symposium, March 1996 |
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| Thermal Evaluation of a Power PC 620 Multi-Processor Computer Henry Wong, Tien-Yu, Tom Lee, Motorola Inc., Tempe, USA. 12th IEEE Semi-Therm Symposium, March 1996 |
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| Optimization of TAB Inner Lead Bonding Process Ilgyu Jung, Taekoo Lee, Joonghyun Baek and Hyungho Kim Samsung Electronics Co., Ltd. 12th IEEE Semi-Therm Symposium, March 1996 |
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| Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling Elias Papanicolaou, Institute for Hydrodynamics, Germany, Sridhar Gopalakrishna, IBM Corporation, San Jose, USA. ASME, Journal of Electronic Packaging, December 1995 |
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| Thermal Characterization of Electronic Devices with Boundary Condition Independent Compact Models Clemens J M Lasance, Heinz Vinke, Harvey Rosten IEEE Transaction, December 1995 |
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| Achieving Accurate Thermal Characterization Using a CFD Code-A Case Study of Plastic Packages Juan Burgos, Vincent P Manno and Kaveh Azar IEEE Transaction, December 1995 |
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T157 |
Using FLOTHERM on thermal design of an optical transmission Kazuyuki Akashi, NEC Engineering Ltd, Tokyo 4th International FLOTHERM User Conference, San Jose, USA, October 95 |
| Thermal design of telecommunications mini cabinet A.Norman, M.Kokko, Nokia Telecommunications 4th International FLOTHERM User Conference, San Jose, USA, October 95 |
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| Thermal design for Fujitsu FCS-1000 outdoor telecommunications cabinet M.Hendrix, I.A.Ali, Fujitsu Network Transmissions Systems Inc. Flomerics Inc. 4th International FLOTHERM User Conference, San Jose, USA, October 95 |
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| Thermal limits of flip chip package-experimentally validated, CFD supported case studies Tien-Yu, Tom Lee, & Mali Mahalingam, Motorola Inc. 4th International FLOTHERM User Conference, San Jose, USA, October 95 |
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| CFD modelling for component-level and board-level thermal analysis; a PBGA interconnect technology for low-velocity air-cooling G.B. Kromann, C.W.Argento, Motorola Inc. 4th International FLOTHERM User Conference, San Jose, USA, October 95 |
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| Cooling component modelling C. R. Biber, Wakefield Engineering Inc. 4th International FLOTHERM User Conference, San Jose, USA, October 95 |
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| Thermal analysis of telephony and video equipment K.Puzyrko, Ericsson Raynet 4th International FLOTHERM User Conference, San Jose, USA, October 95 |
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| A numerical study on the onset of flow reversal in a vertical channel subject to unequal side wall temperatures M.P. Garcia, M.R.Cosley, Reliance Comm/Tec & Reliable Electric 4th International FLOTHERM User Conference, San Jose, USA, October 95 |
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| Thermal modelling and analysis of an aircraft electronics navigation unit under high-altitude conditions I.A.Ali, M.Stefanich, Flomerics Inc. & Eldec Corp. 4th International FLOTHERM User Conference, San Jose, USA, October 95 |
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| A case study for treating FLOTHERM as a piece of thermal test equipment T.Kordyban, Tellabs 4th International FLOTHERM User Conference, San Jose, October 95 |
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| The use of a high-level CFD code in engineering education J.E.S.Venart, P.Lemieux, A.C.M.Sousa, University of New Brunswick/D.Tatchell, Flomerics Limited Engineering Foundation Conference, Canada, July 91 |
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| Modelling of axial fans for electronic equipment J.Hennissen, J.Berghmans, K.U.Leuven/W.Temmerman, Alcatel Bell EUROTHERM Seminar No.45, Leuven, Belgium, September 95 |
| Natural convection heat transfer of metal cuboid flush mounted in a horizontal plate Ir.J.P.A.Drabbels, University of Technology Eindhoven EUROTHERM Seminar No.45, Leuven, Belgium, September 95 |
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| Thermal characterisation and modelling of multi chip modules using standard electronic packages Areski Belache, Thierry Gautier, Jean Claude Boisde, Nicholas Leveau, Guy Paulet, Thomson CSF EUROTHERM Seminar No.45, Leuven, Belgium, September 95 |
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| Natural convection experiments with cuboids and cylinders of equal area R.A.Vanes, R.M.Noort, C.J.M.Lasance, Philips Centre of Manufacturing Technology EUROTHERM Seminar No.45, Leuven, Belgium, September 95 |
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T117 |
Experimental and computational studies on the thermal management of electronics enclosures using natural convection M.P.Garcia, M.R.Cosley, Reliance Comm/Tec/M.J.Marongiu, MJM Consulting Services EUROTHERM Seminar No.45, Leuven, Belgium, September 95 |
| Modelling of IC/Packages based on thermal characteristics I.Ewes, Philips Kommunikations Industrie AG EUROTHERM Seminar No.45, Leuven, Belgium, September 95 |
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| Experimental validation methods for thermal models W.Temmerman, W.Nelemans, T.Goossens, E.Lauwers, Alcatel Bell Telephone/C. Lacaze, Alcatel Elspace EUROTHERM Seminar No.45, Leuven, Belgium, September 95 |
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| Thermal characterisation of electronic devices by means of improved boundary condition Independent compact models H.Vinke, C.Lasance, Philips Centre for Manufacturing Technology EUROTHERM Seminar No.45, Leuven, Belgium, September 95 |
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| Direct Torque Controlled Induction Motor Drive Utilized in an Electrical Vehicle Roy Nilsen, ABB Corporate Research, Tommi Kasteenpohja, ABB Industry OY EPE, October 95 |
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| The Development of Three-dimensional Computational-Fluid-Dynamics Models of PBGA Interconnect Technology for Moderate Air-cooled Systems Christopher W. Argento and Gary B. Kromann, Motorola, Austin, Texas, USA ITAP, March 95 |
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| The Effect of Solder-Joint Temperature Rise on Ceramic-ball-grid Array to Board Interconnection Reliability: The Motorola PowerPC 603 and PowerPC 604 Interpack, March 95 R. David Gerke, Motorola, Austin, Texas, USA |
| Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: C4/Ceramic-ball-grid Array Interconnect Technology Gary B. Kromann, David Gerke, Wayne Huang, Motorola, Austin, Texas, USA ECTC, Las Vegas, USA, May 95 |
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T94
(497KB) |
Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603 and PowerPC 604 RISC Microprocessor Gary B. Kromann, Motorola, Austin, Texas, USA Interpack, March 95 |
| Development, Validation and Application of a Thermal Model of a Plastic Quad Flat Pack H. Rosten, J. Parry & S. Addison/R. Viswanath/M. Davis & E. Fitzgerald, Flomerics Limited / Intel Corp./ University of Limerick ECTC, Las Vegas, USA, May 95 |
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| Numerical Simuation of Natural Convection Heat Transfer in a Television Set Clemens Lasance, Philips, The Netherlands. . 1993 |
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| Thermal Modeling of high performance packages in Portable Computers Ram Viswanath, Intel Corporation, Ihab A. Ali, Flomerics Inc. ECTC, Las Vegas, USA, May 95 |
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T88 |
Thermal Performance of Air-Cooled Hybrid Heat Sinks for a low Velocity Environment Marlin R. Vogel, Advance Technology Department, Sun Microsystems Inc, Milpitas, CA. . IEEE, December 1994 |
| Effect of Circuit Board Parameters on Thermal Performance of Electronic Components in Natural Convection Cooling K Azar, S S Pan, AT&T Bell Laboratories, N. Andover , USA, John Parry and Harvey Rosten, Flomerics Limited. . IEEE, December 1994 |
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Application of a CFD Tool for System-level Thermal Simulation |
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| Development of a high performance low pressure drop water cold-plate for electronic packaging applications Sanjeev B Sathe, Randall J. Stutzman, and Stephen J. Kosteva, Microelectronics Division, IBM Corporation, Endicott, New york.. ASME 1994 ... |
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Using Computational Fluid Dynamics to design Heat Transfer Enhancement methods for cooling channels |
|
T82 |
Simple Temperature Measurements to Calibrate a CFD Model of CPGA/Heatsink Assemblies to Optimise Heatsink Performance Howard Rajala & Christie Ryan, Northern Telecom Limited IEPS, September 94 |
| Thermal Modelling and Experimental Characterization of the C4/Surface-Mount-Array Interconnect Technologies. IEEE, March 1995 Gary B Kromann, Member IEEE. |
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| A Numerical study of Buoyancy-Induced Forced Convection on an Isolated Vertical Plate Ann M. Anderson, Union College, New York. National Heat Transfer Conference, ASME 1995 |
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| Application of a Numerical Tool for Thermal Evaluation of Printed Boards in Communication Systems W. Temmerman, W. Nelemans, R. Hendrix, M. Ryckebusch & L. Rottiers, Alcatel Bell Telephone, Antwerp, Belgium InterSociety Conference on Thermal Phenomena , May 92 |
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T77 |
Numerical and Experimental Study of Forced Convection Over Power Supply Heat Sinks S. Gopalakrishna, IBM Corporation, Endicott, USA ASME Winter Annual Meeting , December 91 |
| Board Level Thermal Analysis with AutoTherm Mentor Graphics 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
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| Cooling of a CPU Board with Two Lines of Four Microprocessors in the Mean Flow Sylvie Boudoux, Bull S.A., Angers Cedex, France 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
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| Thermal Laboratory Design and Measurements Cai Kabrell, Nokia Research Centre, Helsinki, Finland 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
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| FLOTHERM Libraries Presentation and Demonstration Dr Michael Reynell, Ivor Capsey, Flomerics Limited, UK 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
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| The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment Harvey Rosten & Clemens Lasance, Flomerics Limited, UK & Philips CFT, The Netherlands 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
| Estimating the Influence of PCB and Component Thermal conductivity on component temperatures in natural convection Tony Kordyban, Tellabs, Lisle, Illinois, USA 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
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| Siemens Nixdorf Informationssystme AG Business Unit Personal Computer Dr. Anton Breier , Siemens Nixdorf, Germany 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
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| A Study on the Optimal Design Technique of Cabinet Ventilation System by Neural Network D. L. Shin, Y. B. Seo, & L. S. Kim, Samsung Electronics Co. Limited, Kyungki-Do, Korea 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
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| How to Improve the Cooling in Schroff - Standard Cases Using FLOTHERM W. Schild, Schroff, Straubenhardt, Germany 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
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| Application of CFD Technology in Electronic Thermal Management Tom Lee, Ben Chambers & Mali Mahalingam, Motorola, Inc., USA 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
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| Temperature Analysis for SBD-10 Naoki Ishibashi, Seiko Epson, Japan 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
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| Choosing Fan and Heatsink for a New Generation of AC - AC Converters Ernst Schworm, Siemens AG, Munich, Germany 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
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| About the Validation of CFD Analysis of Electronic Systems Clemens J. M. Lasance, Philips CFT, Eindhoven, The Netherlands 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
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|
Heat Transfer Co-efficients in FLOTHERM |
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| FLOTHERM Simulations of Consumer Electronics Products during the Development Process at ITCL - Philips Hilde de Coninck, Philips Industrial Activities, Leuven, Belgium 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
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| Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: the C4/Ceramic-ball-Grid Array Interconnect Technology Gary B. Kromann, David Gerke, Wayne Huang, Motorola, Austin, Texas, USA 3rd International FLOTHERM User Conference, Bramley, UK, September 94 |
| Thermal Analysis of a Telecommunications Rack System Dr. John Parry & Dr. David Tatchell, Flomerics Limited Eurotherm Seminar no. 29 Delft, June 93 |
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| Thermal Modelling of the Pentium Processor Harvey Rosten & Ram Viswanath, Flomerics Limited & Intel Corporation, USA ECTC, May 94 |
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| Two Thermal Simulation Approaches for Electronic Equipment Jean-Louis Blanchard & Jean-Michel Morelle, Racal-Redac TAD, Le Ulis, France Eurotherm Seminar no. 29 Delft, June 93 |
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| Thermal Analysis of a Pin Grid Array Package Vivek Mansingh, Hewlett Packard, Cupertino, USA September 93 |
| Nokia's Use of FLOTHERM Cai Kabrell, Nokia Research Centre, Finland 2nd International FLOTHERM User Conference, Boston, USA, May 93 |
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| Thermal Parametric Analysis of an Underground Battery Vault Michael R. Cosley & Maurice Marongiu, Reliance Comtec, USA 2nd International FLOTHERM User Conference, Boston, USA, May 93 |
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|
T50 |
Air Flow Modelling Requirements Nearby Fans W. Temmerman, W. Nelemans & T. Goosens, Alcatel Bell Telephone, Antwerp, Belgium 2nd International FLOTHERM User Conference, Boston, USA, May 93 |
| Solving the Thermal Design Concerns of a Low-Voltage Power Supply using CFD Modeling Richard M. Parales, Jr ,Lexmark International,Inc., Lexington, USA 2nd International FLOTHERM User Conference, Boston, USA , May 93 |
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| Optimising Environmental Stress Screening using FLOTHERM Tony Kordyban,Tellabs Operations, Inc., Lisle, USA 2nd International FLOTHERM User Conference, Boston, USA , May 93 |
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| Thermal Analysis of a Ceramic Microelectronics Package using FLOTHERM William D. Jeakins, Bell Northern Research, Canada 2nd International FLOTHERM User Conference, Boston, USA , May 93 |
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| Thermal Modelling of a Hewlett Packard Workstation from Concept to Finished Product Lyne Dore-North & David W. Tardiff, Hewlett Packard, Chelmsford, USA 2nd International FLOTHERM User Conference, Boston, USA , May 93 |
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| The Use of FLOTHERM During the Development of a New Telecommunication Equipment Dr. Pavel Valenta, Alcatel SEL, Stuttgart, Germany 2nd International FLOTHERM User Conference, Boston, USA , May 93 |
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| Numerical Simulation Methodology Used for Thermal Design of a Minicomputer Glenn C. Simon, Hewlett Packard, Roseville, USA 2nd International FLOTHERM User Conference, Boston, USA , May 93 |
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| Thermal Simulation in Concept Design of a Complex System Dawn E. Shaffer, Dynair Electronics, Inc., San Diego, USA 2nd International FLOTHERM User Conference, Boston, USA , May 93 |
| System Level Thermal Simulation of a Computer Chassis using FLOTHERM Software Tom Lee & Mali Mahalingam, Motorola, Inc., Pheonix, Arizona, USA 2nd International FLOTHERM User Conference, Boston, USA , May 93 |
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|
T41
(89KB) |
Cooling Studies of IBM Technology Products Performed by the Endicott Electronic Packaging Organisation Jeffrey S. Burdick, IBM Corporation, Endicott, USA 2nd International FLOTHERM User Conference, Boston, USA , May 93 |
| A 3-D, Thermal Analysis of Microprocessors Henry C. Bosak, Sequent Computer Systems, Inc., Beaverton, Oregon, USA 2nd International FLOTHERM User Conference, Boston, USA , May 93 |
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| Flomerics Presentation to JEDEC JC 15 Committee Harvey Rosten, Flomerics Limited 2nd International FLOTHERM User Conference, Boston, USA , May 93 |
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| Thermal Design of the Silicon Graphics Indigo 2 Workstation using Physical and Computational Modelling Chris Wheaton, Silicon Graphics, Mountain View, California, USA 2nd International FLOTHERM User Conference, Boston, USA, May 93 |
| Thermal analysis and environment of FLOTHERM Udo Alt, Siemens Germany 1st International FLOTHERM User Conference, Bramley, UK, September 91 |
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| Thermal Modelling of a Military Laser System Paul Bottomer, GEC Ferranti, UK 1st International FLOTHERM User Conference, Bramley, UK , September 91 |
|
| Software Simulation of the thermal behaviour of Telecommunication Equipment using FLOTHERM Kurt Flad, SEL Alcatel, Germany 1st International FLOTHERM User Conference, Bramley, UK , September 91 |
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| The Application of FLOTHERM to Solving Air Flow and Heat Transfer problems in Power Supplies and Domestic Appliances Andrew Worley, ERA Technology, Leatherhead, UK 1st International FLOTHERM User Conference, Bramley, UK , September 91 |
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| Convection Cooling in Microelectronic Packages: Comparison with FLOTHERM Simulations S. De Smet, G. De Mey and M. Driscart,Laboratory of Electronics, University of Ghent, Belgium 1st International FLOTHERM User Conference, Bramley, UK , September 91 |
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| Use of FLOTHERM within PTT Telecom Fred Herrebout, PTT, The Netherlands 1st International FLOTHERM User Conference, Bramley, UK , September 91 |
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| Simulation of PCB's using FLOTHERM Derek Finch, GEC Marconi Research, Great Baddow, UK 1st International FLOTHERM User Conference, Bramley, UK , September 91 |
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|
T17 |
A Numerical Analysis of Three-Dimensional Conjugate Transport in an Electronic Package Scott Reynolds, Bahgat Sammakia & Mark Girolami,IBM, Endicott,USA - IBM, Greenock, Scotland 1st International FLOTHERM User Conference, Bramley, UK , September 91 |
| Conjugate Heat Transfer of One Component on a PCB in a Small Enclosure C.J.M. Lasance, Philips Centre of Manufacturing Technology, The Netherlands I-Therm Conference, "Work in Progress" session, Austin, Texas, USA , February 92 |
|
| Electronic Cooling at IBM Endicott Jeff Burdick, IBM, Endicott, USA 1st International FLOTHERM User Conference, Bramley, UK , September 91 |
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| Application of the FLOTHERM Thermal Analysis Software to Telecommunication Equipment Dr J D Parry, Dr D G Tatchell, Flomerics Limited IEE Colloquium, London, February 1993 |
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| Supporting experiments for CFD based thermal design of telecommunications equipment H Bruneel, B Beernaert, G Mortier, et al, Alcatel Bell, Antwerp, Belgium. Eurotherm Seminar no. 29 Delft, The Netherlands, June 93 |
|
|
A two-level Micro/Macro Approach to the Simulation of Air Flow and Heat Transfer in Typical Convection-Cooled Electronic Systems Michael J. W. Reynell, Ian W. Clark, and Harvey Rosten, Flomerics Limited |