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What
is FLOPACK?
FLOPACK
ÀºFlomerics¿¡¼ Web ±â¹ÝÀ¸·Î Á¦ÀÛµÈ Á¦Ç°À¸·Î, FLOTHERM
»ç¿ëÀÚ°¡ IC package¸¦ Á¤È®ÇÏ°í ½±°Ô ¸ðµ¨¸µ ÇÒ ¼ö ÀÖµµ·Ï
ÇÕ´Ï´Ù
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How
does FLOPACK work?
FLOPACK
Àº Web ¼¹ö¿¡´Â ¸¶Å©·Î·Î ÀÛ¼º °¡´ÉÇÑ °¢Á¾Smart Part
µéÀ» ³»ÀåÇϰí ÀÖ½À´Ï´Ù. FLOTHERM »ç¿ëÀÚ´Â ±âº» Web browser
¸¦ ÀÌ¿ëÇÏ¿© ¿øÇÏ´Â IC package¿¡ ÇÊ¿äÇÑ µ¥ÀÌÅ͸¦ ÀÔ·ÂÇϽñ⸸
ÇÏ¸é µË´Ï´Ù. ¿¹¸¦ µé¸é ´ÙÀ½°ú °°Àº ÀÔ·Â °ªÀÔ´Ï´Ù.
- Number
of balls
- substrate
conductivity
- die
size
- substrate
metal layer thickness and coverage
ÀÌ·¯ÇÑ
ÀÔ·Â °ªÀ» ÀÌ¿ëÇÏ¿© FLOPACK Àº FLOTHERM ¸ðµ¨À» ÀÚµ¿À¸·Î
¸¸µé°í, »ç¿ëÀÚ´Â ´ÜÁö ±× ¸ðµ¨À» download Çϱ⸸ Çϸé
µË´Ï´Ù. ¸¸¾à »ç¿ëÀÚ°¡ VRML ÀÌ °¡´ÉÇÑ web browser¸¦ »ç¿ëÇϰí
ÀÖ´Ù¸é, ¸ðµ¨À» »ý¼º½Ã۱â Àü¿¡ ÀÔ·Â °ª¿¡ µû¸¥ ¸ðµ¨À»
3D·Î ¹Ì¸® º¸±â¸¦ ÇÏ½Ç ¼ö ÀÖ½À´Ï´Ù
FLOPACK
Àº ÃÖ±Ù¿¡ IC package¸¦ Çü¼ºÇϴµ¥ Á»´õ ½¬¿î ¹æ¹ýÀ» ³»³õ¾Ò½À´Ï´Ù.
±×°ÍÀº JEDEC Library Wizards¶ó°í ºÎ¸£°í ÀÖ½À´Ï´Ù.
ÀÌ JEDEC Library Wizard´Â, »ç¿ëÀÚ°¡ inputs the power,
the die size, package type¸¸À» ÀÔ·ÂÇÏ¸é ¸ðµ¨¸µ¿¡ ÇÊ¿äÇÑ
´Ù¸¥ ¸ðµç µ¥ÀÌÅÍ´Â JEDEC ±ÔÁ¤¿¡ µû¸§À¸·Î½á ¸ðµ¨À» ÀÚµ¿
»ý¼ºÇÕ´Ï´Ù.
ÀÌ·¯ÇÑ
ÀÚµ¿ ¸ðµ¨ »ý¼ºÀÌ °¡´ÉÇÑ ÀÌÀ¯´Â, JEDEC Library Wizard´Â
´ëºÎºÐÀÇ IC package °ø±Þȸ»ç¿¡¼ »ç¿ëÇÏ´Â µðÀÚÀÎ ±ÔÁ¤À»
³»Æ÷Çϰí Àֱ⠳»ÀåÇϰí Àֱ⠶§¹®ÀÔ´Ï´Ù. Áï, »ç¿ëÀÚ°¡
ÁöÁ¤ÇÏÁö ¾ÊÀº µ¥ÀÌÅÍ¿¡ ´ëÇØ¼´Â ÀûÀýÇÑ °ªÀ» ´ë½Å ÀÔ·ÂÇÔÀ¸·Î½á
»ç¿ëÀÚÀÇ ¼ö°í¸¦ ÃÖ¼ÒÈ ÇÕ´Ï´Ù. ÀÌ·¯ÇÑ Wizard´Â
ÇöÀç PQFP, Wire-bonded PBGA, PLCC, TO-220, TO-263 package
µî ¿¡ Àû¿ëµÇ¾î ÀÖÀ¸¸ç °è¼ÓÀûÀÎ update °¡ µÇ°í ÀÖ½À´Ï´Ù.
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How
Does This Help?
FLOPACK
»ç¿ëÀÚ¿¡°Ô ´ÙÀ½°ú °°Àº À̵æÀÌ ÀÖ½À´Ï´Ù.
Best Known
Methods
Flomerics´Â
10³â ÀÌ»ó ÀüÀÚ Á¦Ç° ¾÷°è¿¡ ¿ ÇØ¼® Àü¿ë ¼öÄ¡ÇØ¼® ÇÁ·Î±×·¥À»
Á¦°øÇϰí ÀÖ½À´Ï´Ù. µû¶ó¼ ±× µ¿¾È °¢Á¾ package¿¡ ´ëÇÏ¿©
¼ö¸¹Àº ¸ðµ¨¸µ ³ëÇϿ찡 ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ³ëÇϿ츦 ÇÁ·Î±×·¥È
ÇÏ¿© FLOPACK Smart Part¸¦ ¸¸µé¾úÀ¸¹Ç·Î, FLOPACK »ç¿ëÀÚ´Â
ÀÚ½ÅÀÇ ¸ðµ¨¿¡ Flomerics³ëÇϿ츦 ÀÌ¿ëÇÏ½Ç ¼ö ÀÖ½À´Ï´Ù.
Consistency
& Reliability
FLOPACK»ç¿ëÀÚ´Â
°¢Á¾ packageÀÇ ¸ðµ¨À» ¸¸µå´Âµ¥ ÀÖ¾î, °°Àº ¸ðµ¨¸µ ±â¹ýÀ»
»ç¿ëÇÏ°Ô µË´Ï´Ù. Áï »ç¿ëÀÚ´Â ¸ðµ¨¸µ Â÷ÀÌ¿¡¼ ¹ß»ýÇÏ´Â
¼öÄ¡ÇØ¼®»ó Â÷À̸¦ ÃÖ¼ÒÈ ÇÒ ¼ö ÀÖ¾î, °á°ú °£ÀÇ ½Å·Ú¼ºÀ»
Çâ»ó½Ãų ¼ö ÀÖ½À´Ï´Ù.
Speed
»ç¿ëÀÚ´Â
FLOPACKÀ¸·Î ¸ðµ¨¸µ ÇÒ ¶§, Á÷Á¢ ¸ðµ¨¸µ ÇÏ´Â °Í º¸´Ù ¾à
10¹è °¡±î¿î ½Ã°£ Àý¾àÀ» ÇÏ½Ç ¼ö ÀÖ½À´Ï´Ù. ÀÌ´Â FLOPACKÀÇ
°¡Àå Å« ÀåÁ¡ÀÔ´Ï´Ù

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Why
use the Web?
IC packaging
¾÷°Ô´Â ¾ÆÁÖ ºü¸£°Ô º¯È¸¦ ÇÏ´Â ½ÃÀåÀ̸ç, °ÅÀÇ ¸Å´Þ »õ·Î¿î
ŸÀÔÀÇpackage¸¦ ¼±º¸À̰í ÀÖ½À´Ï´Ù. FLOPACK À» Web
±â¹ÝÀ¸·Î Á¦ÀÛÇÔÀ¸·Î½á, Flomerics´Â »õ·Î¿î IC package
ŸÀÔ¿¡ ´ëÇÏ¿© ºü¸£°í ½±°Ô update ÇÒ ¼ö Àֱ⠶§¹®ÀÔ´Ï´Ù.
ÀÌ´Â »ç¿ëÀÚ°¡ °¡Àå ºü¸¥ ½Ã±â¿¡, ´Ù½Ã ¸»Çϸé ÇÊ¿äÇÑ ½Ã±â¿¡
ÇÊ¿äÇÑ package ¸ðµ¨À» download¸¦ ¹ÞÀ¸½Ç ¼ö ÀÖ½À´Ï´Ù.
Áï »ç¿ëÀÚ´Â »õ·Î¿î package ¸ðµ¨À» ÀÌ¿ëÇϱâ À§ÇÏ¿© ÇÁ·Î±×·¥À»
°¢±â »õ·Î ¼³Ä¡ ÇÒ Çʿ䰡 ¾øÀ¸¸ç, ÀÌ´Â °ð Flomerics°¡
±â¼úÁö¿ø¿¡ ÇÊ¿äÇÑ ½Ã°£°ú ¹°ÀÚ¸¦ ¾Æ³¢´Â µ¥ È¿À²ÀûÀÔ´Ï´Ù.
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Does FLOPACK
Create Detailed or Compact Models?
¸ðµÎ
°¡´ÉÇÕ´Ï´Ù.
Detailed
modelÀº ´ÙÀ½°ú °°Àº ºÎÀ§¶ÇÇÑ »ó¼¼ÇÏ°Ô ¸ðµ¨¸µ ÇÕ´Ï´Ù.
- solder
balls
- thermal
vias
- metal
layers in organic substrates
»ç¿ëÀÚ´Â
´Ù¾çÇÑ CFD ¸ðµ¨¸µ ¿É¼ÇÀ» ÀÌ¿ëÇÏ¿© ¸ðµ¨À» ÀûÀýÇÑ ¼öÁرîÁö
´Ü¼øÈ¸¦ ½Ãų ¼ö ÀÖ½À´Ï´Ù. ¿¹¸¦ µé¾î solder ball array¸¦
¸ðµ¨¸µ Çϴµ¥ ÀÖ¾î, solder ball´ÜÀ§·Î º¹ÀâÇÏ°Ô ¸ðµ¨¸µÀ»
ÇÏ´Â ´Ü°è¿¡¼ ´Ü¼øÈ÷ ÇϳªÀÇ lumped blockÀ¸·Î ¸ðµ¨¸µ
ÇÏ´Â ¼öÁرîÁö ½±°Ô ÁöÁ¤ÇÒ ¼ö ÀÖ½À´Ï´Ù.
Compact
ModelÀº packageÀ» ¼öÄ¡ÀûÀ¸·Î´Â detail model°ú °ÅÀÇ °°Àº
¿Àû °Åµ¿À» ³ªÅ¸³»¸é¼, ¸ðµ¨ ÀÚü´Â ±Ø´ÜÀûÀ¸·Î ´Ü¼øÈµÈ
¸ðµ¨ÀÔ´Ï´Ù. FLOPACKÀº two-resistor, DELPHI model ·Î
ºÒ¸®´Â µÎ °¡Áö Á¾·ùÀÇ compact modelÀ» Á¦°øÇÕ´Ï´Ù.
Two-resistor
compact modelÀº package¸¦ JEDEC Ç¥ÁØ¿¡¼ ±ÔÁ¤ÇÏ´Â Junction-to-Case
¹× Junction-to-Board resistances·Î ±¸¼ºµÇ´Â ¸ðµ¨ÀÔ´Ï´Ù.
ÀÌ´Â ¼öÄ¡ÇØ¼® ÀûÀ¸·Î ±²ÀåÈ÷ ÀÛÀº ¸ðµ¨ (only 2 grid cells)À̸ç,
ÃÖ¾ÇÀÇ Á¶°Ç¿¡¼ junction temperatures ÀÇ ¿ÀÂ÷ ¹üÀ§°¡
20¿¡¼25 % »çÀÌ¿¡ ÀÖ´Â ¸ðµ¨ÀÔ´Ï´Ù. Two-resistor modelÀº
Junction-to-Ambient resistance (Theta-JA) ·Î ´ëº¯µÇ´Â
ÀϹÝÀûÀÎ package ¿ ´ëº¯ °ªÀÌ ÃÖ¾ÇÀÇ °æ¿ì 60% ÀÌ»ó ¿ÀÂ÷
¹üÀ§¸¦ °¡Áö´Âµ¥ ¹ÝÇÏ¿© Å« system level¿¡ Àû¿ëÇϱ⿡
ÀûÇÕÇÑ ¸ðµ¨ ¼öÁØÀÔ´Ï´Ù.
DELPHI
compact modelÀº ÀÏÁ¾ÀÇ Boundary Condition Independent
(BCI) compact model·Î¼ ÁÖº¯È¯°æÀÇ º¯È¿¡ ´ëÇÏ¿© °ÅÀÇ
¿ÀÂ÷ ¹üÀ§°¡ º¯ÇÏÁö ¾Ê´Â ¸ðµ¨ÀÔ´Ï´Ù. BCI ¸ðµ¨ÀÇ ¸ñÀûÀº
junction ¹× case temperature¸¦ ¿¹»óÇϴµ¥ ÀÖ¾î °æ°èÁ¶°Ç¿¡
µ¶¸³ÀûÀ¸·Î ¾à 10% À̳»ÀÇ Á¤È®µµ¸¦ À¯ÁöÇÏ´Â °Í ÀÔ´Ï´Ù.
DELPHI
compact modelÀº DELPHI ÇÁ·ÎÁ§Æ®¿¡ ÀÇÇØ¼ Á¦¾ÈµÈ ¹æ¹ýÀ¸·Î
±¸¼ºµÇ´Â ¸ðµ¨ÀÔ´Ï´Ù. ÀÌ´Â two resistor modelº¸´Ù ¿ùµîÈ÷
Áøº¸µÈ Çü½ÄÀ» °®Ãß°í ÀÖÀ¸¸ç, ¾î¶² °æ°èÁ¶°ÇÀ» °¡Áø system
level¿¡¼µµ Àû¿ë °¡´ÉÇÑ ¸ðµ¨ÀÔ´Ï´Ù. ÀÌ´Â ÇöÀç ¼öÄ¡ÇØ¼®
½Ã°£À» ±Ø´ÜÀûÀ¸·Î ª°Ô ÇØÁÖ¸é¼, Á¤È®µµ´Â ÃÖ¾ÇÀÇ Á¶°Ç¿¡¼
detail model¿¡ ºñÇÏ¿© 15% ÀÌÇÏÀÇ ¿ÀÂ÷ ¹üÀ§¸¦ °¡Áö°í
ÀÖ½À´Ï´Ù.
FLOPACK
Àº PQFP, PLCC, BGA package¿¡ ´ëÇÏ¿© DELPHI ¸ðµ¨À» Áö¿øÇϰí
ÀÖÀ¸¸ç Áö¼ÓÀûÀÎ update°¡ ÀÌ·ç¾î Áö°í ÀÖ½À´Ï´Ù.

¢À
What
IC Packages does FLOPACK Support?
ÇöÀç
FLOPACK Àº ´ÙÀ½°ú °°Àº package ¸ðµ¨À» Áö¿øÇϰí ÀÖ½À´Ï´Ù.
- Plastic
Ball Grid Array (PBGA) - Wirebonded
- PBGA
- Flip-Chip
- PBGA
- Cavity-Down, also known as SuperBGATM
- PBGA
- Stacked (TFBGA)
- Ceramic
Ball Grid Array (CBGA) - Wirebonded
- CBGA
- Flip-Chip
- Tape
Ball Grid Array (TBGA)
- ChipArrayTM
also known as Fine Pitch BGA (FPBGA)
- FPBGA
(Cavity-Down) also known as Board-on-Chip BOCTM
- Ceramic
Pin Grid Array CPGA - Cavity Up
- CPGA
- Cavity Down
- CPGA
- Flip Chip
- MicroBGATM
- Plastic
Quad Flat Pack (PQFP)
- PowerQuadTM
also known as PowerPQFP
- Plastic
Leaded Chip Carrier (PLCC)
- Thin
Small Outline Package (TSOP); Conventional and Lead-on-Chip
leadframes
- Transistor
Outine Packages (TO-220, TO-263)
- Leadless
Leadframe Package (LLPTM); very similar to the MicroLeadFrameTM
package
- PGA
Socket
- Extruded
Heatsink
- Pin
Fin Heatsink
- Disk
Fin Heat Sink
ÀÌ¿Í ´õºÒ¾î
MicroStarTM, SOT, PPGA, stacked memory packages µî °¢Á¾
»õ·Î¿î packageµîÀÌ ÇöÀç ¸ðµ¨ °³¹ßÁß¿¡ ÀÖ½À´Ï´Ù. ¸¸¾à
»ç¿ëÀÚ Áß ÇöÀçÀÇ FLOPACK ¿¡¼ ´Ù·ç°í ÀÖÁö ¾ÊÀº package
¸ðµ¨¿¡ ´ëÇÏ¿© ±ÞÇÏ°Ô ÇÊ¿äÇÏ´Ù¸é, Flomerics¿¡ ¿¬¶ôÀ»
ÇϽʽÿÀ.

¢À
What
Training is Required?
FLOPACK
´Â ¾ÆÁÖ »ç¿ëÇϱⰡ ½¬¿ö¼, FLOTHERM »ç¿ëÀÚ¶ó°í ÇÑ´Ù¸é
º°´Ù¸¥ ºÎ°¡ÀûÀÎ ±³À°Àº ÇÊ¿ä ¾ø½À´Ï´Ù. ±×·¯³ª, ¸¸¾à ±³À°À»
¹ÞÀ¸½Ã°íÀÚ ÇÑ´Ù¸é, FlomericsÀÇ "Modeling
IC Packages with FLOTHERM" ±³À°°úÁ¤¿¡ µî·Ï ¹Ù¶ø´Ï´Ù.
Á»´õ ÀÚ¼¼ÇÑ ¹®ÀÇ´Â support@flopack.com ·Î ÇÏ½Ã¸é µË´Ï´Ù.
¢À
What
kind of documentation is there?
FLOPACK
°ü·Ã ÀÚ·á´Â on-lineÀ¸·Î µÇ¾î ÀÖÀ¸¸çWeb site¿¡¼ Á¢±ÙÀÌ
°¡´ÉÇÕ´Ï´Ù. ÀÚ·á°¡ Æ÷ÇÔÇϰí ÀÖ´Â ³»¿ëÀº, discussions
of the input parameters , modeling options for each
packages, general information and advice on modeling,
cross-references to other Internet sources on package
level µîµîÀ» ´Ù·ç°í ÀÖ½À´Ï´Ù.
¢À
Does
FLOPACK have any other functions or tools?
±×·¸½À´Ï´Ù.
FLOPACK ˼ JEDEC Still Air Tests, Wind Tunnel Tests,
JEDEC Ring Cold Plate Tests°ú °°Àº Ç¥ÁØÈµÈ ½ÇÇè configurationÀ»
³»ÀåÇϰí ÀÖ½À´Ï´Ù.
¢À
How
can I access FLOPACK?
¸ðµçFLOTHERM
»ç¿ëÀÚ´Â FLOTHERM User Support Area ¿¡¼ »ç¿ëÇÏ´Â id¿Í
¾ÏÈ£¸¦ »ç¿ëÇÏ¿© FLOPACK ¿¡ Á¢¼ÓÇÏ½Ç ¼ö ÀÖÀ¸¸ç, 5
¹ø¿¡ ÇÑÇÏ¿© ½ÃÇèÇØ º¸½Ç ¼ö ÀÖ½À´Ï´Ù.
http://www.flopack.com/
Á¢¼ÓÈÄ
"Access Your Workbench" ¿É¼ÇÀ» ¼±ÅÃÇϽʽÿÀ.
ÀÌ´Â ÀÚµ¿ÀûÀ¸·Î Çѹø¿¡ ÇÑÇÏ¿©1°³¿ùµ¿¾È ¹«·á·Î 5¹ø ÀÌ¿ëÇϽÇ
¼ö ÀÖ´Â ¶óÀ̼¾½º¸¦ ºÎ¿©ÇÕ´Ï´Ù. FLOTHERM User Support
Area ¾ÏÈ£¸¦ °¡Áö°í °è½ÃÁö ¾ÊÀº FLOTHERM »ç¿ëÀÚ´Â ´ÙÀ½
web site¿¡¼ ¾ÏÈ£¸¦ ºÎ¿© ¹ÞÀ¸½Ã±â ¹Ù¶ø´Ï´Ù.
http://www.flotherm.com/passapp.htm
¾ÏÈ£¸¦
ºÎ¿© ¹ÞÀ¸½Å ÈÄ (ÀϹÝÀûÀ¸·Î 1-2ÀÏ Á¤µµ ¼Ò¿äµË´Ï´Ù.) À§¿¡¼
¼³¸íÇÑ ´Ü°è¸¦ ¹âÀ¸½Ê½Ã¿À.
¢À
What do
I need to run FLOPACK?
1. ÀÎÅͳÝÀÌ
¿¬°áµÇ¾î ÀÖ¾î¾ß ÇÕ´Ï´Ù. FLOPACK Àº ´ë¿ªÆø¿¡ ¹Î°¨ÇÏÁö
¾ÊÁö¸¸, 56 kbs ÀÌ»óÀÇ ´ë¿ªÆøÀ» °¡Áø ÀÎÅÍ³Ý È¸¼±À»
ÃßõÇÕ´Ï´Ù.
2. Web
browser - Netscape version 4 ÀÌ»ó, ¶Ç´ÂInternet Explorer
version 5 ÀÌ»óÀÌ ÇÊ¿äÇÕ´Ï´Ù.
3. ¸ðµ¨À»
½ÇÇà½Ãų ¼ö ÀÖ´Â FLOTHERM.
4. [¿É¼Ç]
A VRML browser ¶Ç´Â plug-in ÀÌ ÀÖ¾î¾ß Çü¼º½ÃŲ ¸ðµ¨¿¡
´ëÇÏ¿© ¹Ì¸®º¸±â¸¦ ÇÏ½Ç ¼ö ÀÖ½À´Ï´Ù. FLOPACK Àº VRML
Level 1À» »ç¿ëÇÕ´Ï´Ù. ´ÙÀ½ web site¿¡¼ ÀûÀýÇÑ browser
¶Ç´Â plug-inÀ» ãÀ¸½Ê½Ã¿À.
http://www.web3d.org/vrml/browpi.htm
¢À
I don't
have FLOTHERM - Can I still use FLOPACK?
FLOPACK
¿¡¼ downloadµÈ ¸ðµ¨Àº FLOTHERMÀ» ÅëÇØ¼¸¸ ¼öÄ¡ÇØ¼®ÀÌ
°¡´ÉÇÕ´Ï´Ù.
FLOTHERM¿¡
´ëÇÏ¿© Á»´õ ¾Ë°í ½ÍÀ¸½Ã¸é ½ÅÇÑ ¹«¿ª 031-714-6303À¸·Î
¿¬¶ôÇϽðųª e-mailÀ» »ç¿ëÇϽʽÿÀ.
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